航空、航太

航空航太領域複雜的測量任務的解決方案,如高可靠性部件或強度測試。

Determination of Pb in solder alloys for high reliability applications

For most electronics applications it is prohibited to use solders that contain lead (RoHS and WEEE directives). However, the so-called tin whiskers that sometimes grow from the surface of unleaded solder can cause short circuits – posing an unacceptable risk for high reliability (“hi-rel”) applications in aerospace and military use. To prevent this defect, a minimum lead content of 3 wt% is specified for solder used in hi-rel applications. Because the consequences of failure could be so dangerous, these specifications must be verified through measurement of the lead content. 

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